专利名称：Method for producing electronic
components
发明人：Jurgen Leib,Florian Bieck申请号：US11603388申请日：20061122
公开号：US20070063202A1公开日：20070322
专利附图：
摘要：In order to achieve an integration of functional structures into the housing ofelectronic components, provision is made of a method for producing an electroniccomponent comprising at least one semiconductor element having at least one sensor-
technologically active and/or emitting device on at least one side, the method comprisingthe following steps: provision of at least one die on a wafer, production of at least onepatterned support having at least one structure which is functional for the sensor-technologically active and/or emitting device, joining together of the wafer with the atleast one support, so that that side of the die which has the sensor-technologically activeand/or emitting device faces the support, separation of the die.
申请人：Jurgen Leib,Florian Bieck
地址：Freising DE,Mainz DE
国籍：DE,DE
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